收藏本站
6. Power-on/Reset State
When power is first applied to the device, or when recovering from a reset condition, the device
will default to SPI Mode 3. In addition, the SO pin will be in a high-impedance state, and a high-
to-low transition on the CS pin will be required to start a valid instruction. The SPI mode will be
automatically selected on every falling edge of CS by sampling the inactive clock state. After
power is applied and V CC is at the minimum datasheet value, the system should wait 20 ms
before an operational mode is started.
Table 6-1.
Detailed Bit-level Addressing Sequence
Address Byte
Address Byte
Address Byte
Additional
Don’t Care
Bytes
Opcode
Opcode
Required
50H
52H
53H
54H
55H
56H
0 1 0 1 0 0 0 0 r
0 1 0 1 0 0 1 0 r
0 1 0 1 0 0 1 1 r
0 1 0 1 0 1 0 0 x
0 1 0 1 0 1 0 1 r
0 1 0 1 0 1 1 0 x
r
r
r
x
r
x
r
r
r
x
r
x
r
r
r
x
r
x
P
P
P
x
P
x
P
P
P
x
P
x
P
P
P
x
P
x
P
P
P
x
P
x
P
P
P
x
P
x
P
P
P
x
P
x
P
P
P
x
P
x
P
P
P
x
P
x
x
P
P
x
P
x
x
P
P
x
P
x
x
P
P
x
P
x
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
x
B
N/A
4 Bytes
N/A
1 Byte
N/A
1 Byte
57H
0 1 0 1 0 1 1 1
N/A
N/A
N/A
N/A
58H
59H
60H
61H
68H
81H
82H
83H
84H
85H
86H
87H
88H
89H
D2H
D4H
D6H
0 1 0 1 1 0 0 0 r
0 1 0 1 1 0 0 1 r
0 1 1 0 0 0 0 0 r
0 1 1 0 0 0 0 1 r
0 1 1 0 1 0 0 0 r
1 0 0 0 0 0 0 1 r
1 0 0 0 0 0 1 0 r
1 0 0 0 0 0 1 1 r
1 0 0 0 0 1 0 0 x
1 0 0 0 0 1 0 1 r
1 0 0 0 0 1 1 0 r
1 0 0 0 0 1 1 1 x
1 0 0 0 1 0 0 0 r
1 0 0 0 1 0 0 1 r
1 1 0 1 0 0 1 0 r
1 1 0 1 0 1 0 0 x
1 1 0 1 0 1 1 0 x
r
r
r
r
r
r
r
r
x
r
r
x
r
r
r
x
x
r
r
r
r
r
r
r
r
x
r
r
x
r
r
r
x
x
r
r
r
r
r
r
r
r
x
r
r
x
r
r
r
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
P
P
P
P
P
P
P
P
x
P
P
x
P
P
P
x
x
x
x
x
x
B
x
B
x
B
B
x
B
x
x
B
B
B
x
x
x
x
B
x
B
x
B
B
x
B
x
x
B
B
B
x
x
x
x
B
x
B
x
B
B
x
B
x
x
B
B
B
x
x
x
x
B
x
B
x
B
B
x
B
x
x
B
B
B
x
x
x
x
B
x
B
x
B
B
x
B
x
x
B
B
B
x
x
x
x
B
x
B
x
B
B
x
B
x
x
B
B
B
x
x
x
x
B
x
B
x
B
B
x
B
x
x
B
B
B
x
x
x
x
B
x
B
x
B
B
x
B
x
x
B
B
B
x
x
x
x
B
x
B
x
B
B
x
B
x
x
B
B
B
N/A
N/A
N/A
N/A
4 Bytes
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
4 Bytes
1 Byte
1 Byte
D7H
1 1 0 1 0 1 1 1
N/A
N/A
N/A
N/A
E8H
1 1 1 0 1 0 0 0 r
r
r
r
P
P
P
P
P
P
P
P
P
P
P
B
B
B
B
B
B
B
B
B
4 Bytes
Note:
12
r = Reserved Bit
P = Page Address Bit
B = Byte/Buffer Address Bit
x = Don’t Care
AT45DB041B
3443D–DFLSH–2/08
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
AT45DB081B-TI IC FLASH 8MBIT 20MHZ 28TSOP
AT45DB161B-TI IC FLASH 16MBIT 20MHZ 28TSOP
AT45DB321-TC IC FLASH 32MBIT 13MHZ 32TSOP
AT45DB321B-TI IC FLASH 32MBIT 20MHZ 32TSOP
AT45DB321C-TC IC FLASH 32MBIT 40MHZ 28TSOP
AT45DB642-TC IC FLASH 64MBIT 20MHZ 40TSOP
AT88CK9000-8TH CRYPTO PROGRAMMER BOARD 8-TSSOP
AT88SC12816C-MJ IC EEPROM 128KBIT 1.5MHZ M2J
相关代理商/技术参数
AT45DB041B-TI-2.5 功能描述:IC FLASH 4MBIT 20MHZ 28TSOP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:378 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:8M（1M x 8，512K x 16） 速度:110ns 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-CBGA 供应商设备封装:48-CBGA（7x7） 包装:托盘
AT45DB041B-TU 功能描述:IC FLASH 4MBIT 20MHZ 28TSOP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:RAM 存储器类型:SDRAM 存储容量:256M（8Mx32） 速度:143MHz 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:托盘 其它名称:Q2841869
AT45DB041-CC 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:4-Megabit 2.7-volt Only Serial DataFlash
AT45DB041-CI 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:4-Megabit 2.7-volt Only Serial DataFlash
AT45DB041D 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:4-megabit 2.5-volt or 2.7-volt DataFlash
AT45DB041D_07 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:4-megabit 2.5-volt or 2.7-volt DataFlash
AT45DB041D_08 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:4-megabit 2.5-volt or 2.7-volt DataFlash
AT45DB041D-DWF 制造商:Adesto Technologies Corporation 功能描述:WHOLE WAFER, NO BACKGRIND - Gel-pak, waffle pack, wafer, diced wafer on film